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Event Overview:
The SMTA and Chip Scale Review are pleased to announce plans for the 13th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.
Here are some of the conference and expo highlights from 2015:
650 attendees
65 exhibiting companies with 195 booth staff in attendance
16 countries represented
43 technical papers
Each year, IWLPC's venue in the heart of Silicon Valley also provides attendees with a great opportunity to network and meet with industry experts. We look forward to another successful conference next year and are actively looking for interested experts to participate in the technical committees. Each year, it is our key contributors who maintain the high technical quality of the presentations with which IWLPC has become synonymous.
Exhibitor Information:
Why Exhibit at IWLPC?
- Reach a focused international audience
- Generate Exposure in this highly competitive marketplace
- Share New Products and concepts to the market
- Enhance Relationships with existing customers and generate new leads
About SMTA:
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
About Chip Scale Review:
Chip Scale Review is the leading global magazine going into its 18th year covering device and wafer-level test, assembly, and packaging. While holding true to its founding mission, as packaging has evolved, so too has Chip Scale Review, which now also covers high-density interconnection technologies including 3D packages, MEMS, and other wafer-fabricated devices. We are proud to be part of an industry that has been responsible for many of the major technological breakthroughs since the “birth” of the integrated circuit.
Source : Event Website
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